Project Details

  • Clients Tier-1 Semiconductor Foundries
    (TSMC, YMTC, Kioxia)
  • Team Kunshi Semiconductor Containment
    R&D & Cleanroom QA Team
  • Services UHP 316L VIM-VAR Electropolishing
    (Ra ≤ 0.25μm) & Cleanroom Assembly
  • Category Semiconductor & UHP

Engineering Overview

Designed to meet the zero-micro-contamination demands of global semiconductor foundries, the Kunshi Vessel UHP Electronic Specialty Gas Cylinder provides exceptional inner-surface passivation for toxic, corrosive, and flammable electronic specialty gases (ESGs). Addressing critical “bottleneck” packaging challenges, our proprietary ultra-pure 316L stainless steel processing achieves Ra ≤ 0.25μm mirror finish and ultra-low helium leak rates (< 1×10⁻⁹ mbar·L/s), ensuring maximum yield rates for advanced IC manufacturing.

Key Technical Specifications

Target Applications6N/7N Electronic Specialty Gases (Silane, NF3, HCl, BCl3, Ammonia)
Inner Surface Roughness (Ra)Ra ≤ 0.25μm (10 μin) Mirror Electropolished (EP)
Shell Metallurgy316L VIM-VAR Stainless Steel / Ultra-Pure Austenitic Steel
Helium Leak Rate< 1 × 10⁻⁹ mbar·L/s (Vacuum Chamber Audited)
Cleanroom ProcessingClass 10/100 DI Water Rinsing & Ultra-Pure Nitrogen Purging
Tier-1 Foundry ApprovalCertified & Adopted by TSMC, YMTC, and Kioxia

Structural & Quality Highlights

  • Advanced Electropolishing (EP): Electrochemical anodic dissolution levels microscopic high points, generating a dense Chromium Oxide (Cr₂O₃) passive layer (Cr/Fe ≥ 1.5) to resist aggressive fluorinated/chlorinated gas pitting
  • Zero Particle Shedding: Microscopic SEM inspection (10,000x) ensures complete elimination of fissures, abrasive inclusions, and moisture-trapping micro-scratches.
  • Strict National Standard Compliance: Engineered in accordance with National Standard “Welded Stainless Steel Cylinders” and 14th Five-Year Plan national projects
  • Global Regulatory Compliance: Certified with US DOT 3AA/3AL, ASME Section VIII, EU TPED (Pi Mark π), and China TS license

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